In PHOENICS, Nanoscribe will develop new hardware- and software-based solutions for photonic packaging. A key challenge for the industrialization of photonically packaged systems is the wide variety of different photonic platforms which typically all have different optical coupling interfaces. Efficient optical coupling without active alignment thus becomes almost impossible. Nanoscribe intends to integrate the results of the project into complete photonic packaging solutions consisting of automated systems, software, photoresins, and corresponding processes. As hardware platform, Nanoscribe will use Quantum X and aims to establish an advanced platform as the industry standard for next-generation photonic packaging.