Based on its expertise in InP- and polymer-based photonic components, Fraunhofer HHI will be responsible for the development of the input modulation units in WP2. These consist of arrayed waveguide gratings and modulator-amplifier arrays, which will be fabricated in HHI’s clean room facilities and assembled into the input modulation units. Additionally, HHI will contribute to the packaging effort in WP7 by providing the electrical contact leads for the high-speed modulation of the data.